hi-sincerity microelectronics corp. spec. no. : preliminary data issued date : 2001.07.01 revised date : 2001.07.26 page no. : 1/3 h1n5820, H1N5821, h1n5822 hsmc product specification h1n5820 thru h1n5822 3.0 amps. schottky barrier rectifiers features ? low forward voltage drop ? high current capability ? high reliability ? high surge current capability mechanical data ? cases: do-201ad molded plastic. ? epoxy: ul 94v-0 rate flame retardant. ? lead: axial leads, solderable per mil-std-202, method 208 guaranteed. ? polarity: color band denotes cathode end. ? high temperature soldering guaranteed: 250 c/10 seconds/.375?(9.5mm) lead lengths at 5 lbs., (2.3kg) tension. ? weight: 1.10 grams. maximum ratings ratings at 25 c ambient temperature unless otherwise specified. single phase, half wave, 60 hz, resistive or inductive load. for capacitive load, derate current by 20%. type number h1n5820 H1N5821 h1n5822 units maximum recurrent peak reverse voltage 20 30 40 v maximum rms voltage 14 21 28 v maximum dc blocking voltage 20 30 40 v maximum average forward rectified current 0.375"(9.5mm) lead length @ tl=90 c 3a peak forward surge current, 8.3ms single half sine-wave superimposed on rated load (jedec method) 80 a maximum instantaneous forward voltage @ 3a 0.475 0.5 0.525 v maximum instantaneous forward voltage @ 9a 0.85 0.9 0.95 v maximum dc reverse current at rated dc blocking voltage 2 (@ ta=25 c) 20 (@ ta=100 c) ma ma typical thermal resistance (note 1) r ja 40 c /w typical junction capacitance (note 2) 250 pf operating temperature range tj -65 to +125 c storage temperature range tstg -65 to +125 c note 1: thermal resistance from junction to ambient vertical p.c. board mounting, 0.375?(9.5mm) lead length. note 2: measured at 1mhz and applied reverse voltage of 4v d.c.
hi-sincerity microelectronics corp. spec. no. : preliminary data issued date : 2001.07.01 revised date : 2001.07.26 page no. : 2/3 h1n5820, H1N5821, h1n5822 hsmc product specification characteristics curve
hi-sincerity microelectronics corp. spec. no. : preliminary data issued date : 2001.07.01 revised date : 2001.07.26 page no. : 3/3 h1n5820, H1N5821, h1n5822 hsmc product specification do-201 dimension *:typical inches millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.0472 0.0512 1.20 1.30 d 1.0000 - 25.40 - b 1.0000 - 25.40 - e 0.1890 0.2087 4.80 5.30 c 0.2835 0.3740 7.20 9.50 notes : 1.dimension and tolerance based on our spec. dated may 28,1998. 2.controlling dimension : millimeters. 3.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.if there is any question with packing specification or packing method, please contact your local hsmc sales office. material : ? lead : axial leads, solderable per mil-std-202, method 208 guaranteed. ? mold compound : epoxy resin family, flammability solid burning class: ul94v-0 important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of hsmc. ? hsmc reserves the right to make changes to its products without notice. ? hsmc semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? hsmc assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. head office and factory : ? head office (hi-sincerity microelectronics corp.) : 10f.,no. 61, sec. 2, chung-shan n. rd. taipei taiwan r.o.c. tel : 886-2-25212056 fax : 886-2-25632712, 25368454 ? factory 1 : no. 38, kuang fu s. rd., fu-kou hsin-chu industrial park hsin-chu taiwan. r.o.c tel : 886-3-5983621~5 fax : 886-3-5982931 e b c a d do-201 molded plastic package hsmc package code: l
|
